Silver Welding Metal Bonded Concrete Grinding Plate For HTC Systems

Metal Bond Concrete Grinding Plates for HTC

Application:

Installed on HTC systems and used for the general purpose of concrete floor or terrazzo surface grinding.

The metal bond diamonds are offered with one and two segments. Choosing between one or two segments allows the operator to control the grinding speed. Two-segment tools are designed for heavier machines, inches. Single-segment tools are designed for lighter machines, or where aggressive stock removal is required. We recommend using single-segment tools for the first step even with heavier machines for faster opening of the concrete.

Different Shapes we can supply:

Other shapes could be available upon request.

MBT-HTC-001
MBT-HTC--002
MBT-HTC--003
MBT-HTC--004
MBT-HTC--005

Grit Available:

16#, 18/20#, 20/25#,25/30#, 30/40#,50/60#,60/80#,80/100#,120/150#

Bond Type:

extra soft(XS), soft(S), Medium(M), hard(H), extra hard(XH)

We recommend you to choose right bond based on the PSI or MOH’s of concrete:

But it still depends on your true situation for bond choosing. We’d like to offer you a better solution if detailed information is available.

diamond cup wheel for concrete

metal bond diamond wheel

Silver Welding Metal Bonded Concrete Grinding Plate For HTC Systems Images